IMWS-AMP 2027

IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications

Where innovation meets inspiration. Viana do Castelo welcomes the world.

10–12 August 2027Viana do Castelo, Portugal
Submit a paper by 28 March See the program
Coração de Viana em filigrana dourada, com roseta central e volutas tradicionais

A workshop on the materials behind tomorrow's RF and THz systems

IMWS-AMP is an annual series of international events on advanced materials, devices, integration technologies and applications for RF, microwave, millimeter-wave and THz systems. It gives the microwave community a place for technical exchange, education and collaboration.

IMWS-AMP 2027 takes place in Viana do Castelo, Portugal, from 10 to 12 August 2027. Expect invited and contributed papers, keynote talks, and plenty of time to meet people from academia, research institutions and industry.

The series began in Suzhou in 2015 and has since travelled through China, Italy, the USA, Germany and, in 2026, Australia. 2027 is its first edition in Portugal.

Important dates

  • 28 March 2027Paper submission deadline
  • 23 April 2027Notification of acceptance
  • 14 May 2027Final paper submission
  • 10–12 August 2027Conference, Viana do Castelo

Topics include, but are not limited to

Advanced materials for RF and microwave

  • 2D materials and carbon nanotubes for electronic and optoelectronic devices
  • Wide bandgap and emerging semiconductors for high-frequency applications
  • Magnetic, superconducting and spin-wave materials for RF and THz

Innovative manufacturing and integration

  • Additive and large-area manufacturing (3D printing, inkjet) for RF and THz components
  • Advanced packaging and integration for 5G, mmWave and IoT
  • Ceramic and polymer-based substrates for microwave devices

Flexible and wearable antennas and systems

  • Flexible materials and processes for RF electronics and antennas
  • Integrated antennas and RF components for wearable IoT devices

Metamaterials and intelligent wave engineering

  • Metamaterials and plasmonics for absorption, cloaking and wave manipulation
  • Antennas leveraging artificial and engineered materials
  • Reconfigurable intelligent surfaces (RIS) for smart wireless environments

Integrated microwave and THz devices

  • Passive and active microwave/THz devices including filters, amplifiers and modulators

Advanced applications and characterization

  • Wireless communications, radar, imaging and sensing
  • Material characterization for RF, microwave and THz technologies

Submit your work

View the Call for Papers poster (PDF)

Paper submission

Submit your manuscript as a PDF through EDAS. Papers must be in English and no longer than three pages. All papers are peer-reviewed, and every accepted paper presented at the conference will be included in IEEE Xplore.

Submit via EDAS

Best student paper awards

Judged on originality, significance, technical soundness, presentation quality and relevance. To qualify, the first author must be a full-time student and must present the paper at the conference.

Special issue

A selection of papers presented at IMWS-AMP 2027 will be invited to submit to an IEEE journal or special issue. Details will be announced on this website.

Three days, one walkable campus

Draft schedule. Technical sessions run morning and afternoon, with coffee breaks between them. Session details will follow once papers are accepted.

Calendar download includes all 23 agenda entries. Times are to be confirmed, so entries are provisionally listed as all-day events. For Google Calendar, download the .ics file and import it through Settings → Import & export.

Tue 10 AugWed 11 AugThu 12 Aug
MorningTechnical sessions
Coffee break
Technical sessions		Technical sessions
Coffee break
Technical sessions		Technical sessions
Coffee break
Technical sessions
LunchLunch at ESTG, on campus
AfternoonTechnical sessions
Coffee break
Technical sessions		Technical sessions
Coffee break
Technical sessions		Technical sessions
Coffee break
Technical sessions
EveningReception dinner at SantoinhoGala dinner at Flor de Sal–

Committees

Organizing committee
Nuno Borges Carvalho, General ChairUniversity of Aveiro / Instituto de Telecomunicações, Portugal
Sérgio Ivan Lopes, Co-General Chair (Local Chair)ADIT-Lab / IPVC, Portugal
Technical program committee
Malgorzata Celuch, ChairWarsaw University of Technology, Poland
Imran Mehdi, Co-ChairJet Propulsion Laboratory / NASA, USA
João AbrantesProMetheus / IPVC, Portugal
Bruno ExpostoADIT-Lab / IPVC, Portugal
Ramin RahmaniCTIN, Portugal
Ricardo TorresInstituto de Telecomunicações, Portugal
Ricardo PereiraUniversidade de Coimbra, Portugal
Steering committee
Yongxin GuoCity University of Hong Kong, China
Maurizio BozziUniversity of Pavia, Italy
Yujian ChengSoutheast University, China
Raafat MansourUniversity of Waterloo, Canada
Amir MortazawiUniversity of Michigan, USA
Ilona RolfesRuhr University Bochum, Germany
Valentina PalazziUniversity of Perugia, Italy
Chairs and secretariat
Luís Rocha, International Advisory Committee ChairProMetheus / IPVC, Portugal
Raquel Madureira, Publicity ChairUniversity of Aveiro, Portugal
Jorge Garcia, Local Arrangements Co-ChairADIT-Lab / IPVC, Portugal
Adélio Cavadas, Local Arrangements Co-ChairProMetheus / IPVC, Portugal
Olinda Lopes, Local Organizing SecretariatIPVC, Portugal

Discover Viana do Castelo

The conference is hosted by the Instituto Politécnico de Viana do Castelo (IPVC), on a modern campus with conference-ready auditoriums, versatile rooms and full technical support. The city sits between the Lima River and the Atlantic Ocean.

Between sessions, explore the hilltop Santa Luzia sanctuary and its views over the coast, the Eiffel Bridge across the Lima, the Festas da Agonia (the city's best-known celebration) and the gold filigree and folklore traditions of the Minho.

Open venue in Maps

30 minmaximum walk from most hotels
6 mintypical ride by Uber

Getting there

From Porto Airport (OPO), 65 km south: about an hour from landing to the city centre.

  • Train: about 60 minutes
  • Express bus: about 44 minutes

Lisbon Airport (LIS) is about 380 km south and also offers wide connections across Europe.

Join us in Viana do Castelo

Mark 10–12 August 2027 in your calendar, and send your three-page paper by 28 March 2027. Registration details and fees will be published here.

info2027@imws-amp.org